Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects

Rouhollah Mousavi Iraei, Phillip Bonhomme, Nickvash Kani, Sasikanth Manipatruni, Dmitri E. Nikonov, Ian A. Young, Azad Naeemi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The energy-per-bit and delay of All-Spin Logic (ASL) interconnects have been modeled. Both Al and Cu interconnect channels have been considered and the impact of size effects and dimensional scaling on their potential performance has been quantified. It is predicted that size effects will affect ASL interconnects more severely than electrical interconnects.

Original languageEnglish (US)
Title of host publication2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014
PublisherIEEE Computer Society
Pages353-356
Number of pages4
ISBN (Print)9781479950164
DOIs
StatePublished - Jan 1 2014
Externally publishedYes
Event2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014 - San Jose, CA, United States
Duration: May 20 2014May 23 2014

Publication series

Name2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014

Conference

Conference2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014
CountryUnited States
CitySan Jose, CA
Period5/20/145/23/14

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Iraei, R. M., Bonhomme, P., Kani, N., Manipatruni, S., Nikonov, D. E., Young, I. A., & Naeemi, A. (2014). Impact of dimensional scaling and size effects on beyond CMOS All-Spin Logic interconnects. In 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014 (pp. 353-356). [6831833] (2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014). IEEE Computer Society. https://doi.org/10.1109/IITC.2014.6831833