Immersion cooling with water-based fluid using nano-structured coating

Nenad Miljkovic (Inventor), Thomas P Foulkes (Inventor), Patrick Birbarah (Inventor), Tarek Gebrael (Inventor), Andrew R Stillwell (Inventor), Robert C.N. Pilawa-Podgurski (Inventor)

Research output: Patent


A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.
Original languageEnglish (US)
U.S. patent number11692271
StatePublished - Jul 4 2023


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