Image sensor with general spatial processing in a 3D integrated circuit technology

Viktor Gruev; Jan Van Der Spiegel; Ralf M. Philippe; Ralph Etienne-Cummings

Image sensor with general spatial processing in a 3D integrated circuit technology

Viktor Gruev, Jan Van Der Spiegel, Ralf M. Philippe, Ralph Etienne-Cummings

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An architectural overview of an image sensor with general spatial processing capabilities on the focal plane is presented. The system has been fabricated on two separate tiers, implemented on silicon-on-insulator technology with vertical interconnect capabilities. One tier is dedicated to imaging, where photosensitivity and pixel AU have been optimized. The subsequent layers contain noise suppression and digitally controlled analog processing elements, where general spatial filtering is computed. The digitally controlled aspect of the processing unit allows generic receptive fields to be computed on read out. The image is convolved with four receptive fields in parallel. The chip provides parallel readout of the filtered results and the intensity image.

Original language	English (US)
Title of host publication	ISCAS 2006
Subtitle of host publication	2006 IEEE International Symposium on Circuits and Systems, Proceedings
Pages	4963-4966
Number of pages	4
State	Published - 2006
Externally published	Yes
Event	ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems - Kos, Greece Duration: May 21 2006 → May 24 2006

Publication series

Name	Proceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)	0271-4310

Other

Other	ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems
Country/Territory	Greece
City	Kos
Period	5/21/06 → 5/24/06

ASJC Scopus subject areas

Electrical and Electronic Engineering

Library availability

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Image sensor with general spatial processing in a 3D integrated circuit technology. / Gruev, Viktor; Van Der Spiegel, Jan; Philippe, Ralf M. et al.
ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, Proceedings. 2006. p. 4963-4966 1693745 (Proceedings - IEEE International Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Gruev, V, Van Der Spiegel, J, Philippe, RM & Etienne-Cummings, R 2006, Image sensor with general spatial processing in a 3D integrated circuit technology. in ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, Proceedings., 1693745, Proceedings - IEEE International Symposium on Circuits and Systems, pp. 4963-4966, ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems, Kos, Greece, 5/21/06.

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AB - An architectural overview of an image sensor with general spatial processing capabilities on the focal plane is presented. The system has been fabricated on two separate tiers, implemented on silicon-on-insulator technology with vertical interconnect capabilities. One tier is dedicated to imaging, where photosensitivity and pixel AU have been optimized. The subsequent layers contain noise suppression and digitally controlled analog processing elements, where general spatial filtering is computed. The digitally controlled aspect of the processing unit allows generic receptive fields to be computed on read out. The image is convolved with four receptive fields in parallel. The chip provides parallel readout of the filtered results and the intensity image.

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M3 - Conference contribution

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T2 - ISCAS 2006: 2006 IEEE International Symposium on Circuits and Systems

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ER -

Image sensor with general spatial processing in a 3D integrated circuit technology

Abstract

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Other

ASJC Scopus subject areas

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