Abstract
In this paper, we present a new chip-level electrothermal timing simulator for CMOS VLSI circuits. Given the chip layout, the packaging specification, and the periodic input signal pattern, it finds the on-chip steady-state temperature profile and the resulting circuit performance. A tester chip has been designed for verification of ILLIADS-T, and very good agreement between simulation and experiment was found. Using this electrothermal simulator, temperature-dependent reliability and timing problems of VLSI circuits can be accurately identified.
Original language | English (US) |
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Pages (from-to) | 668-681 |
Number of pages | 14 |
Journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
Volume | 17 |
Issue number | 8 |
DOIs | |
State | Published - 1998 |
Keywords
- Cmos integrated circuits
- Electrothermal effects
- Integrated circuit reliability
- Temperature
- Timing
ASJC Scopus subject areas
- Software
- Computer Graphics and Computer-Aided Design
- Electrical and Electronic Engineering