Original language | English (US) |
---|---|
Article number | 7103575 |
Pages (from-to) | iii-iv |
Journal | 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 |
DOIs | |
State | Published - 2014 |
Event | 23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 - Portland, United States Duration: Oct 26 2014 → Oct 29 2014 |
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering