IEEE 23nd Conference on Electrical Performance of Electronic Packaging and Systems

Dale Becker, Jose Schutt-Aine

Research output: Contribution to journalEditorial

Original languageEnglish (US)
Article number7103575
Pages (from-to)iii-iv
Journal2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
DOIs
StatePublished - May 7 2015
Event23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 - Portland, United States
Duration: Oct 26 2014Oct 29 2014

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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