ICCAD roundtable the many challenges of triple patterning [ICCAD Roundtable]

William Joyner, Jamil Kawa, Lars Liebmann, David Z. Pan, Martin Wong, David Yeh

Research output: Contribution to journalArticle

Abstract

More and more techniques are being used to go down the Moore's law curve to smaller dimensions while being stuck at the same 193-nm wavelength light source, and multiple patterning methods are chief among them. This roundtable discusses the move from double patterning to triple patterning and beyond. What is the status of triple patterning today, and what does it really solve? At what dimension will it show its benefit? Will quadruple patterning be next, and when? How does multiple patterning fit in with a roadmap that includes extreme ultraviolet (EUV), direct write, and directed self-assembly? The panelists discuss the state of the art and future challenges.

Original languageEnglish (US)
Article number6874606
Pages (from-to)52-58
Number of pages7
JournalIEEE Design and Test
Volume31
Issue number4
DOIs
StatePublished - Aug 2014

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Self assembly
Light sources
Wavelength

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

ICCAD roundtable the many challenges of triple patterning [ICCAD Roundtable]. / Joyner, William; Kawa, Jamil; Liebmann, Lars; Pan, David Z.; Wong, Martin; Yeh, David.

In: IEEE Design and Test, Vol. 31, No. 4, 6874606, 08.2014, p. 52-58.

Research output: Contribution to journalArticle

Joyner, W, Kawa, J, Liebmann, L, Pan, DZ, Wong, M & Yeh, D 2014, 'ICCAD roundtable the many challenges of triple patterning [ICCAD Roundtable]', IEEE Design and Test, vol. 31, no. 4, 6874606, pp. 52-58. https://doi.org/10.1109/MDAT.2014.2337471
Joyner, William ; Kawa, Jamil ; Liebmann, Lars ; Pan, David Z. ; Wong, Martin ; Yeh, David. / ICCAD roundtable the many challenges of triple patterning [ICCAD Roundtable]. In: IEEE Design and Test. 2014 ; Vol. 31, No. 4. pp. 52-58.
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