TY - JOUR
T1 - ICCAD roundtable the many challenges of triple patterning [ICCAD Roundtable]
AU - Joyner, William
AU - Kawa, Jamil
AU - Liebmann, Lars
AU - Pan, David Z.
AU - Wong, Martin
AU - Yeh, David
PY - 2014/8
Y1 - 2014/8
N2 - More and more techniques are being used to go down the Moore's law curve to smaller dimensions while being stuck at the same 193-nm wavelength light source, and multiple patterning methods are chief among them. This roundtable discusses the move from double patterning to triple patterning and beyond. What is the status of triple patterning today, and what does it really solve? At what dimension will it show its benefit? Will quadruple patterning be next, and when? How does multiple patterning fit in with a roadmap that includes extreme ultraviolet (EUV), direct write, and directed self-assembly? The panelists discuss the state of the art and future challenges.
AB - More and more techniques are being used to go down the Moore's law curve to smaller dimensions while being stuck at the same 193-nm wavelength light source, and multiple patterning methods are chief among them. This roundtable discusses the move from double patterning to triple patterning and beyond. What is the status of triple patterning today, and what does it really solve? At what dimension will it show its benefit? Will quadruple patterning be next, and when? How does multiple patterning fit in with a roadmap that includes extreme ultraviolet (EUV), direct write, and directed self-assembly? The panelists discuss the state of the art and future challenges.
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U2 - 10.1109/MDAT.2014.2337471
DO - 10.1109/MDAT.2014.2337471
M3 - Article
AN - SCOPUS:84906225353
SN - 2168-2356
VL - 31
SP - 52
EP - 58
JO - IEEE Design and Test
JF - IEEE Design and Test
IS - 4
M1 - 6874606
ER -