A combined spectral and finite element analysis is performed to investigate the dynamic edge delamination of patterned thin films from a substrate. The analysis is motivated by an emerging experimental technique in which high-amplitude laser-induced stress waves initiate progressive interfacial debonding of thin film interfaces. The numerical method relies on the spectral representation of the elastodynamic solutions for the substrate and the finite element model for the thin film. A cohesive model is introduced along the interface of the bimaterial system to capture the decohesion process. The important role of the film inertia on the crack extension and the appearance of the mixed-mode failure are demonstrated by observing the traction stress evolution at various points along the bond line. Parametric studies on the effect of film thickness, interface fracture toughness, loading pulse shape and amplitude on the debonding process are performed. A semi-analytical investigation on the inertial effect is carried out to predict the final crack length as a function of the film thickness and pulse amplitude.

Original languageEnglish (US)
Pages (from-to)4217-4233
Number of pages17
JournalEngineering Fracture Mechanics
Issue number14
StatePublished - Sep 2008


  • Adhesion
  • Cohesive model
  • Delamination
  • Dynamic fracture
  • Laser pulse
  • Spectral method
  • Thin film

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials


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