Hybrid photonic integration

J. M. Dallesasse, B. Kesler, T. O'Brien, G. L. Su, J. Carlson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Integration of compound semiconductors with CMOS provides a path for improving performance and increasing functionality. Methods for integrating photonic materials are examined, and the resulting thermal environment modeled. Integration of III-N materials is also discussed.

Original languageEnglish (US)
Title of host publicationProceedings of Frontiers in Optics 2015, FIO 2015
PublisherOptica Publishing Group (formerly OSA)
ISBN (Electronic)9781943580033
DOIs
StatePublished - 2015
EventFrontiers in Optics 2015, FIO 2015 - San Jose, United States
Duration: Oct 18 2015Oct 22 2015

Publication series

NameProceedings of Frontiers in Optics 2015, FIO 2015

Other

OtherFrontiers in Optics 2015, FIO 2015
Country/TerritoryUnited States
CitySan Jose
Period10/18/1510/22/15

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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