Hybrid lithography for triple patterning decomposition and E-beam lithography

Haitong Tian, Hongbo Zhang, Zigang Xiao, Martin D.F. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As we advances into 14/10nm technology node, single patterning technology is far from enough to fabricate the features with shrinking feature size. According to International Technology Roadmap for Semiconductors in 2011, 1 double patterning lithography is already available for massive productions in industry for sub-32nm half pitch technology node. For 14/10nm technology node, double patterning begins to show its limitations as it uses too many stitches to resolve the native coloring conflicts. Stitches will increase the manufacturing cost, lead to potential functional errors of the chip, and cause the yield lost. Triple patterning lithography and E-Beam lithography are two emerging techniques to beat the diffraction limit for current optical lithography system. In this paper, we investigate combining the merits of triple patterning lithography and E-Beam lithography for standard cell based designs. We devise an approach to compute a stitch free decomposition with the optimal number of E-Beam shots for row structure layout. The approach is expected to highlight the necessity and advantages of using hybrid lithography for advanced technology node.

Original languageEnglish (US)
Title of host publicationOptical Microlithography XXVII
PublisherSPIE
ISBN (Print)9780819499752
DOIs
StatePublished - Jan 1 2014
Event27th Optical Microlithography Conference, OM 2014 - San Jose, CA, United States
Duration: Feb 25 2014Feb 27 2014

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9052
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

Other27th Optical Microlithography Conference, OM 2014
CountryUnited States
CitySan Jose, CA
Period2/25/142/27/14

Keywords

  • E-Beam
  • Hybrid Lithography
  • Triple Patterning Lithography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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