Hybrid integration of VCSELs to foundry fabricated smart pixels

R. Pu, E. M. Hayes, C. W. Wilmsen, Kent D Choquette, K. M. Geib, H. Q. Hou

Research output: Contribution to journalArticle

Abstract

The hybrid integration of vertical cavity emitting laser (VCSEL) to a foundry fabricated opto-electronic integrated circuit (OEIC) was realized by flip-chip bump-bonding a backemitting VCSEL array. An OEIC smart pixel is a structure composed of optical inputs and/or outputs interconnected to electronic processing circuitry. The results of improved integration processing and VCSEL design that will increase yields and mechanical and electrical robustness were presented including a new approach to bonding VCSEL directly to the smart pixels.

Original languageEnglish (US)
Pages (from-to)25-26
Number of pages2
JournalLEOS Summer Topical Meeting
StatePublished - 1997
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Atomic and Molecular Physics, and Optics

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    Pu, R., Hayes, E. M., Wilmsen, C. W., Choquette, K. D., Geib, K. M., & Hou, H. Q. (1997). Hybrid integration of VCSELs to foundry fabricated smart pixels. LEOS Summer Topical Meeting, 25-26.