The hybrid integration of vertical cavity emitting laser (VCSEL) to a foundry fabricated opto-electronic integrated circuit (OEIC) was realized by flip-chip bump-bonding a backemitting VCSEL array. An OEIC smart pixel is a structure composed of optical inputs and/or outputs interconnected to electronic processing circuitry. The results of improved integration processing and VCSEL design that will increase yields and mechanical and electrical robustness were presented including a new approach to bonding VCSEL directly to the smart pixels.
|Original language||English (US)|
|Number of pages||2|
|Journal||LEOS Summer Topical Meeting|
|State||Published - 1997|
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Atomic and Molecular Physics, and Optics