@inproceedings{d789671c8eec4d858402fbb2c423e3ab,
title = "How to Kill the Second Bird with One ECC: The Pursuit of Row Hammer Resilient DRAM",
abstract = "Error-correcting code (ECC) has been widely used in DRAM-based memory systems to address the exacerbating random errors following the fabrication process scaling. However, ECCs including the strong form of Chipkill have not been so effective against Row Hammer (RH), which incurs bursts of errors discretely corrupting the whole row beyond the ECC correction capability. We propose Cube, a novel chip-wise physical to DRAM address randomization scheme that leverages the abundant detection capability of on-die-ECC (OECC) and correction capability of Chipkill against RH. Cube allows for synergistic cooperation between ECC, probabilistic RH-protection schemes, and the system with minimal to no modification for each. First, Cube scrambles the rows of each chip using a boot-time key in a way that distributes RH victims to multiple Chipkill codewords. Second, Cube utilizes the newly observed distinct RH error characteristics from real DRAM chips, to swiftly diagnose the RH victim rows using the error profile from OECC scrubbing, and even correct it leveraging Chipkill. When combined, Cube decreases the failure probability of PARA and a state-of-the-art RH protection scheme SRS by up to 10- 25. At a target failure probability of 10- 10 per year on a DDR5 rank under the RH threshold of 2K, Cube reduces the performance and table size overhead of SRS by up to 24.3% and 39.9%, respectively.",
keywords = "DRAM, Memory system, main memory, row-hammer, security",
author = "Kim, {Michael Jaemin} and Minbok Wi and Jaehyun Park and Seoyoung Ko and Jaeyoung Choi and Hwayoung Nam and Kim, {Nam Sung} and Ahn, {Jung Ho} and Eojin Lee",
note = "This work was in part supported by an Institute of Information & communications Technology Planning & Evaluation (IITP) grant funded by the Korea government (MSIT) (No. 2021-0-00863 and 2021-0-01343), a National Research Foundation of Korea (NRF) grant by the Korea government (MSIT) (NRF-2022R1F1A1062826), and a grant from PRISM, one of the seven centers in JUMP 2.0, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. Nam Sung Kim has a financial interest in Samsung Electronics and NeuroRealityVision. The EDA tool was supported by the IC Design Education Center (IDEC), Korea. Michael Jaemin Kim, Minbok Wi, Jaehyun Park, Seoyoung Ko, Jaeyoung Choi, and Hwayong Nam are with the Department of Intelligence and Information, Seoul National University (SNU), Seoul, South Korea. Jung Ho Ahn, the corresponding author, is with the Department of Intelligence and Information and the Interdisciplinary Program in Artificial Intelligence, SNU. This work was in part supported by an Institute of Information&communications Technology Planning&Evaluation (IITP) grant funded by the Korea government (MSIT) (No. 2021-0-00863 and 2021-0-01343), a National Research Foundation of Korea (NRF) grant by the Korea government (MSIT) (NRF-2022R1F1A1062826), and a grant from PRISM, one of the seven centers in JUMP 2.0, a Semiconductor Research Corporation (SRC) program sponsored by DARPA. Nam Sung Kim has a financial interest in Samsung Electronics and NeuroRealityVision. The EDA tool was supported by the IC Design Education Center (IDEC), Korea. Michael Jaemin Kim, Minbok Wi, Jaehyun Park, Seoyoung Ko, Jaeyoung Choi, and Hwayong Nam are with the Department of Intelligence and Information, Seoul National University (SNU), Seoul, South Korea. Jung Ho Ahn, the corresponding author, is with the Department of Intelligence and Information and the Interdisciplinary Program in Artificial Intelligence, SNU.; 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023 ; Conference date: 28-10-2023 Through 01-11-2023",
year = "2023",
month = oct,
day = "28",
doi = "10.1145/3613424.3623777",
language = "English (US)",
series = "Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023",
publisher = "Association for Computing Machinery",
pages = "986--1001",
booktitle = "Proceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023",
address = "United States",
}