How to Kill the Second Bird with One ECC: The Pursuit of Row Hammer Resilient DRAM

Michael Jaemin Kim, Minbok Wi, Jaehyun Park, Seoyoung Ko, Jaeyoung Choi, Hwayoung Nam, Nam Sung Kim, Jung Ho Ahn, Eojin Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Error-correcting code (ECC) has been widely used in DRAM-based memory systems to address the exacerbating random errors following the fabrication process scaling. However, ECCs including the strong form of Chipkill have not been so effective against Row Hammer (RH), which incurs bursts of errors discretely corrupting the whole row beyond the ECC correction capability. We propose Cube, a novel chip-wise physical to DRAM address randomization scheme that leverages the abundant detection capability of on-die-ECC (OECC) and correction capability of Chipkill against RH. Cube allows for synergistic cooperation between ECC, probabilistic RH-protection schemes, and the system with minimal to no modification for each. First, Cube scrambles the rows of each chip using a boot-time key in a way that distributes RH victims to multiple Chipkill codewords. Second, Cube utilizes the newly observed distinct RH error characteristics from real DRAM chips, to swiftly diagnose the RH victim rows using the error profile from OECC scrubbing, and even correct it leveraging Chipkill. When combined, Cube decreases the failure probability of PARA and a state-of-the-art RH protection scheme SRS by up to 10- 25. At a target failure probability of 10- 10 per year on a DDR5 rank under the RH threshold of 2K, Cube reduces the performance and table size overhead of SRS by up to 24.3% and 39.9%, respectively.

Original languageEnglish (US)
Title of host publicationProceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023
PublisherAssociation for Computing Machinery
Pages986-1001
Number of pages16
ISBN (Electronic)9798400703294
DOIs
StatePublished - Oct 28 2023
Event56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023 - Toronto, Canada
Duration: Oct 28 2023Nov 1 2023

Publication series

NameProceedings of the 56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023

Conference

Conference56th Annual IEEE/ACM International Symposium on Microarchitecture, MICRO 2023
Country/TerritoryCanada
CityToronto
Period10/28/2311/1/23

Keywords

  • DRAM
  • Memory system
  • main memory
  • row-hammer
  • security

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Renewable Energy, Sustainability and the Environment

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