Abstract
Using inductively-coupled-plasma reactive ion etching (ICP-RIE), recessed 1 μm gate-length enhancement-mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs) were fabricated. These 1 μm gate-length devices exhibited maximum drain current density of 470 mA/mm, extrinsic transconductance of 248 mS/mm and threshold voltage of 75 mV. These characteristics are much higher than previously reported values for GaN-based E-mode HEMTs. A unity gain cutoff frequency (fr) of 8 GHz and a maximum frequency of oscillation (fmax) of 26 GHz were also measured on these devices.
Original language | English (US) |
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Pages (from-to) | 1758-1760 |
Number of pages | 3 |
Journal | Electronics Letters |
Volume | 39 |
Issue number | 24 |
DOIs | |
State | Published - Nov 27 2003 |
Externally published | Yes |
ASJC Scopus subject areas
- Electrical and Electronic Engineering