High Thermal Conductivity Semicrystalline Epoxy Resins with Anthraquinone-Based Hardeners

Guangxin Lv; Elynn Jensen; Christopher M. Evans; David G. Cahill

doi:10.1021/acsapm.1c00737

High Thermal Conductivity Semicrystalline Epoxy Resins with Anthraquinone-Based Hardeners

Guangxin Lv, Elynn Jensen, Christopher M. Evans, David G. Cahill

Research output: Contribution to journal › Article › peer-review

Abstract

Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (μ0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is μ2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

Original language	English (US)
Pages (from-to)	4430-4435
Number of pages	6
Journal	ACS Applied Polymer Materials
Volume	3
Issue number	9
DOIs	https://doi.org/10.1021/acsapm.1c00737
State	Published - Sep 10 2021

Keywords

crystallinity
epoxy resin
minimum thermal conductivity model
molecular structure
semicrystal
thermal conductivity

ASJC Scopus subject areas

Polymers and Plastics
Process Chemistry and Technology
Organic Chemistry

Online availability

10.1021/acsapm.1c00737

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title = "High Thermal Conductivity Semicrystalline Epoxy Resins with Anthraquinone-Based Hardeners",

abstract = "Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (μ0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is μ2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.",

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author = "Guangxin Lv and Elynn Jensen and Evans, {Christopher M.} and Cahill, {David G.}",

note = "Funding Information: This work was supported by a grant from the ALTANA Institute. This work was supported in part by the National Science Foundation Engineering Research Center for Power Optimization of Electro Thermal Systems (POETS) under cooperative agreement EEC-1449548. The sample preparation and measurements were carried out in part in the Frederick Seitz Materials Research Laboratory Central Research Facilities at the University of Illinois. Publisher Copyright: {\textcopyright} 2021 American Chemical Society.",

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doi = "10.1021/acsapm.1c00737",

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AU - Lv, Guangxin

AU - Jensen, Elynn

AU - Evans, Christopher M.

AU - Cahill, David G.

N1 - Funding Information: This work was supported by a grant from the ALTANA Institute. This work was supported in part by the National Science Foundation Engineering Research Center for Power Optimization of Electro Thermal Systems (POETS) under cooperative agreement EEC-1449548. The sample preparation and measurements were carried out in part in the Frederick Seitz Materials Research Laboratory Central Research Facilities at the University of Illinois. Publisher Copyright: © 2021 American Chemical Society.

PY - 2021/9/10

Y1 - 2021/9/10

N2 - Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (μ0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is μ2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

AB - Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (μ0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is μ2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

KW - crystallinity

KW - epoxy resin

KW - minimum thermal conductivity model

KW - molecular structure

KW - semicrystal

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High Thermal Conductivity Semicrystalline Epoxy Resins with Anthraquinone-Based Hardeners

Abstract

Keywords

ASJC Scopus subject areas

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