Polymers with enhanced thermal conductivity are in great demand for thermal management of electronic devices. However, the thermal conductivity of polymers is typically low (μ0.2 W/(m K)). In this work, four epoxy resins were cured using one commercial diepoxide and four diamine hardeners with an anthraquinone structure. The thermal conductivity of one epoxy resin reached 0.52 W/(m K), which is μ2.5 times that of common polymers. These epoxy resins are shown to have a semicrystalline structure, and both the thermal conductivity and density of the four epoxy resins exhibited a positive correlation with crystallinity.

Original languageEnglish (US)
Pages (from-to)4430-4435
Number of pages6
JournalACS Applied Polymer Materials
Issue number9
StatePublished - Sep 10 2021


  • crystallinity
  • epoxy resin
  • minimum thermal conductivity model
  • molecular structure
  • semicrystal
  • thermal conductivity

ASJC Scopus subject areas

  • Polymers and Plastics
  • Process Chemistry and Technology
  • Organic Chemistry

Cite this