High-Speed Selective Electroplating with Single Circular Jets

Richard C. Alkire, Tan Jen Chen

Research output: Contribution to journalArticlepeer-review

Abstract

High-speed selective electroplating of circular deposits with a jet system was investigated by both experimental and theoretical studies. Direct measurement of current distribution was made with a sectioned electrode made of concentricrings. Three systems were studied, including alkaline ferricyanide reduction, copper deposition from acidified sulfate solution, and copper deposition from an acidified sulfate solution that also contained a ferric/ferrous redox couple. In these systems, current distribution data were obtained upon controlled variation of jet Reynolds number, electrolyte conductivity, reactant concentration, and applied total current. A mathematical model of the process was developed that included mass transfer, ohmic resistance, charge transfer, cell geometry, and multiple electrode reactions. The mathematical model was used to generate dimensionless contour maps indicating generalized conditions under which selective high-speed electroplating can be accomplished.

Original languageEnglish (US)
Pages (from-to)2424-2432
Number of pages9
JournalJournal of the Electrochemical Society
Volume129
Issue number11
DOIs
StatePublished - Nov 1982

Keywords

  • cell
  • current density
  • electrodeposition
  • mass transport

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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