TY - GEN
T1 - High-speed link design optimization using machine learning SVR-AS method
AU - Ma, Hanzhi
AU - Li, Er Ping
AU - Cangellaris, Andreas C.
AU - Chen, Xu
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/10
Y1 - 2020/10
N2 - This paper proposes a novel and fast constrained design optimization method based on support vector regression-active subspace method. The proposed optimization method calculates a linear combination of original design parameters named active variable as a low-dimensional representation of high-dimensional design space to transform the non-linear constraint into a reduced linear constraint for optimization problems, which successfully derives a simplified and mathematically solvable equation. A complex high-speed link with 16-dimensional design parameters is utilized to verify this method and results show that the proposed method can efficiently find the optimal design structures compared to interior-point method.
AB - This paper proposes a novel and fast constrained design optimization method based on support vector regression-active subspace method. The proposed optimization method calculates a linear combination of original design parameters named active variable as a low-dimensional representation of high-dimensional design space to transform the non-linear constraint into a reduced linear constraint for optimization problems, which successfully derives a simplified and mathematically solvable equation. A complex high-speed link with 16-dimensional design parameters is utilized to verify this method and results show that the proposed method can efficiently find the optimal design structures compared to interior-point method.
UR - http://www.scopus.com/inward/record.url?scp=85096951285&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85096951285&partnerID=8YFLogxK
U2 - 10.1109/EPEPS48591.2020.9231368
DO - 10.1109/EPEPS48591.2020.9231368
M3 - Conference contribution
AN - SCOPUS:85096951285
T3 - EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems
BT - EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020
Y2 - 5 October 2020 through 7 October 2020
ER -