High speed interconnects of multi-layer PCB analysis by using non-conformal domain decomposition method

Yang Shao, Zhen Peng, Jin Fa Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of high-speed interconnects on multi-scale, multi-layer printed circuit board (PCB) in this paper. The accuracy and robustness of the proposed method is first demonstrated by analysis of a 4-layer differential pair. Then we studied a 14-layer 16 traces interconnect model to demonstrate the efficiency of the method. Eye diagrams of the two models are studied for time domain SI.

Original languageEnglish (US)
Title of host publicationIEEE International Symposium on Electromagnetic Compatibility, EMC 2010 - Final Program
Pages637-642
Number of pages6
DOIs
StatePublished - Dec 1 2010
Externally publishedYes
Event2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010 - Fort Lauderdale, FL, United States
Duration: Jul 25 2010Jul 30 2010

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076

Other

Other2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010
Country/TerritoryUnited States
CityFort Lauderdale, FL
Period7/25/107/30/10

Keywords

  • Domain decomposition method
  • Maxwell's equations
  • Second order transmission conditions
  • Signal integrity

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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