@inproceedings{3f8f895c73274e9b9e8925e894904553,
title = "High speed interconnects of multi-layer PCB analysis by using non-conformal domain decomposition method",
abstract = "A non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of high-speed interconnects on multi-scale, multi-layer printed circuit board (PCB) in this paper. The accuracy and robustness of the proposed method is first demonstrated by analysis of a 4-layer differential pair. Then we studied a 14-layer 16 traces interconnect model to demonstrate the efficiency of the method. Eye diagrams of the two models are studied for time domain SI.",
keywords = "Domain decomposition method, Maxwell's equations, Second order transmission conditions, Signal integrity",
author = "Yang Shao and Zhen Peng and Lee, {Jin Fa}",
year = "2010",
doi = "10.1109/ISEMC.2010.5711351",
language = "English (US)",
isbn = "9781424463053",
series = "IEEE International Symposium on Electromagnetic Compatibility",
pages = "637--642",
booktitle = "IEEE International Symposium on Electromagnetic Compatibility, EMC 2010 - Final Program",
note = "2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010 ; Conference date: 25-07-2010 Through 30-07-2010",
}