TY - JOUR
T1 - High power keeps cool
AU - Lucas, Michael
AU - Shanbhag, Naresh
AU - Roy, Kaushik
AU - Kurdahi, Fadi
AU - Fagan, John
N1 - Funding Information:
This work was supported by Dr. Robert Reuss of DARPA/MTO, under the Mission-Specific Processing Contract NBCHC010038. The authors thank the participating members of the team, most notably Ken Delson, Dave Fry, Rob Kober, Joe Matesic, Steve Shauck, and Jennifer Trotta of Northrop Grumman; Timothy M. Wilson, Jeffrey A. Geib, Eric J. Martina, Ming Zhang, Byonghyo Shim, and Brian Lam of the University of Illinois; Yongtao Wang, Hamid Mahmoodi-Meimand, Hunsoo Choo, Woopyo Jeong, Jong-sun Park, Lihyih Chiou, and Mark Johnson of Purdue University; and S. Safavi, M. H. Lee, A. Niktash of Morpho Technologies.
PY - 2004/7
Y1 - 2004/7
N2 - Under the Defense Advanced Research Projects Agency (DARPA)-sponsored Mission-Specific Processing (MSP) project, a team of researchers developed and demonstrated low-power, high-performance application-specific integrated circuit (ASIC) cells and computation techniques to provide 10x throughput performance per watt improvements to meet next-generation DoD sensor-processing applications. The resulting designs include a fluid IP core generator, reduced-complexity algorithms, advanced I/O circuits, and reconfigurable cores.
AB - Under the Defense Advanced Research Projects Agency (DARPA)-sponsored Mission-Specific Processing (MSP) project, a team of researchers developed and demonstrated low-power, high-performance application-specific integrated circuit (ASIC) cells and computation techniques to provide 10x throughput performance per watt improvements to meet next-generation DoD sensor-processing applications. The resulting designs include a fluid IP core generator, reduced-complexity algorithms, advanced I/O circuits, and reconfigurable cores.
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U2 - 10.1109/MCD.2004.1317947
DO - 10.1109/MCD.2004.1317947
M3 - Article
AN - SCOPUS:4043119204
SN - 8755-3996
VL - 20
SP - 22
EP - 30
JO - IEEE Circuits and Devices Magazine
JF - IEEE Circuits and Devices Magazine
IS - 4
ER -