Under the Defense Advanced Research Projects Agency (DARPA)-sponsored Mission-Specific Processing (MSP) project, a team of researchers developed and demonstrated low-power, high-performance application-specific integrated circuit (ASIC) cells and computation techniques to provide 10x throughput performance per watt improvements to meet next-generation DoD sensor-processing applications. The resulting designs include a fluid IP core generator, reduced-complexity algorithms, advanced I/O circuits, and reconfigurable cores.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering