Keyphrases
Additive Manufacturing
100%
Zigzag
100%
Thermal Management
100%
Metal-polymer
100%
Pressure Drop
100%
High Power Density
100%
Hybrid Polymer
100%
Baseline Design
100%
Semiconductor Packaging
100%
Nitrides
66%
Heat Sink
66%
Pin Fin
66%
MOSFET
33%
Design Parameters
33%
Maximum Temperature
33%
High Power
33%
Power Level
33%
Finite Element
33%
Coolant
33%
Design Optimization
33%
Electrical Isolation
33%
Power Electronics
33%
Fin Width
33%
Thermophysical Properties
33%
Thermal Performance
33%
Heat Flux
33%
Structure Design
33%
Cooling Water
33%
Temperature Drop
33%
Liquid-cooled
33%
Ethylene Glycol-water
33%
Low Thermal Resistance
33%
Heat Spreader
33%
Cooling Strategies
33%
Cost-effective Solution
33%
Cooling Structure
33%
Thermal Management Applications
33%
Fin Design
33%
Heat Sink Temperature
33%
Fin Height
33%
Heat Rejection
33%
Finning
33%
Single-phase Immersion Cooling
33%
Novec
33%
Silicon Carbide (SiC) MOSFET
33%
Copper Heat Sink
33%
Straight Fins
33%
Fin Arrangement
33%
Aluminum Heat Sink
33%
Structure Integration
33%
Wide-bandgap Semiconductor Devices
33%
TO-247
33%
Cooling Integration
33%
Hybrid Cooling
33%
Engineering
Power Density
100%
Pressure Drop
100%
Metal-Oxide-Semiconductor Field-Effect Transistor
66%
Nitride
66%
Finite Element Method
33%
Design Parameter
33%
Heat Flux
33%
Semiconductor Device
33%
Optimised Design
33%
Maximum Temperature
33%
Electrical Isolation
33%
Optimal Design
33%
Numerical Approach
33%
Thermal Resistance
33%
Thermal Performance
33%
Power Level
33%
Power Electronics
33%
Temperature Drop
33%
Effective Solution
33%
Sink Temperature
33%
Fin Height
33%
Wide Bandgap Semiconductor
33%
Heat Rejection
33%
Material Science
Density
100%
Metal-Oxide-Semiconductor Field-Effect Transistor
100%
Aluminum
100%
Aluminum Nitride
100%
Finite Element Method
50%
Semiconductor Device
50%
Silicon Carbide
50%
Coolant
50%
Heat Resistance
50%
Thermophysical Property
50%
Wide Bandgap Semiconductor
50%
Chemical Engineering
Aluminum Nitride
100%
Ethylene
50%
Heat Flux
50%
Silicon Carbide
50%