High performance domain decomposition methods for signal integrity modeling in 3-D interconnects

Keyphrases

• High Performance 100%
• In(III) 100%
• Domain Decomposition Method 100%
• Signal Integrity 100%
• 3D Interconnects 100%
• Performance Domain 100%
• Integrity Modeling 100%
• Problem-based 50%
• Time Complexity 50%
• Geometry-aware 50%
• Volume-based 50%
• Integrated Circuits 50%
• Surface Mounting 50%
• Proposed Work 50%
• Metal Layer 50%
• Superior Performance 50%
• High Functionality 50%
• Computational Algorithm 50%
• Solution Strategies 50%
• High Performance Computing 50%
• 3D Stacking 50%
• System Designer 50%
• Differential Equation Solver 50%
• Problem Domain 50%
• Product Level 50%
• Electromagnetic Solvers 50%
• Hybrid Solutions 50%
• Interconnected Model 50%
• Local Characteristics 50%
• Integrated Package 50%
• Stacking Technique 50%
• Adaptive Geometry 50%
• 3D Circuits 50%
• Computing Architecture 50%
• Interconnection Technology 50%
• Physical Domain 50%
• Full Wave Electromagnetics 50%
• Geometric Complexity 50%

Computer Science

• Subdomains 100%
• Domain Decomposition Methods 100%
• Signal Integrity 100%
• High-Performance Computing 50%
• Physical Domain 50%
• Computer Architecture 50%
• Time Complexity 50%
• Superior Performance 50%
• System Designer 50%
• Hybrid Solution 50%
• Integrated Circuit 50%