High performance domain decomposition methods for signal integrity modeling in 3-D interconnects

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Advances in interconnect technologies, such as the increase of the number of metal layers and 3-D stacking technique, have paved the way for higher functionality and superior performance while reducing size, power, and cost in modern integrated circuit and packages. However, whether or not the package preserves signal integrity has become a crucial concern for system designers. In this study, a scalable multi-scale full-wave electromagnetic solver is proposed for 3-D circuit/package simulations. The key ideas of the proposed work include: (1) adaptive geometry-aware domain decomposition methods to conquer the geometric complexity of physical domain, by which an arbitrarily complicated interconnect model can be decomposed into a collection of components, the so-called sub-domains; (2) a flexibly hybrid solution strategy, where volume-based differential equation solvers and surface-based integral solvers can be applied to individual sub-domain problems based on local characteristics; and (3) parallel and scalable computational algorithms to reduce the time complexity via high performance computing architectures. The strength and flexibility of the proposed method will be illustrated by means of several product-level package benchmark.

Original languageEnglish (US)
Title of host publication2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages147-150
Number of pages4
ISBN (Electronic)9781479936410
DOIs
StatePublished - May 7 2015
Externally publishedYes
Event23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 - Portland, United States
Duration: Oct 26 2014Oct 29 2014

Publication series

Name2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014

Other

Other23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
CountryUnited States
CityPortland
Period10/26/1410/29/14

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Peng, Z., & Shao, Y. (2015). High performance domain decomposition methods for signal integrity modeling in 3-D interconnects. In 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014 (pp. 147-150). [7103619] (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2014.7103619