Abstract
Ever-increasing complexity in high-speed electronic devices and systems presents significant computational challenges in the numerical analysis in terms of desired accuracy, efficiency, and scalable parallelism. The objective of this paper is to investigate high-resolution, high-performance full-wave field solvers for scalable electromagnetic simulations of product-level integrated circuits (ICs) and electronics. The emphasis is placed on advancing parallel algorithms that are provably scalable facilitating a design-through-analysis paradigm, and enabling concurrent multiscale modeling and computation. The capability and the benefits of the algorithms are validated and illustrated through complex 3-D IC and electronics applications.
| Original language | English (US) |
|---|---|
| Article number | 7817743 |
| Pages (from-to) | 653-668 |
| Number of pages | 16 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 7 |
| Issue number | 5 |
| DOIs | |
| State | Published - May 2017 |
| Externally published | Yes |
Keywords
- Domain decomposition (DD) method
- electromagnetic interference (EMI)
- integrated circuit (IC)
- signal integrity (SI)
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering