High-efficiency cooling via the monolithic integration of copper on electronic devices

Keyphrases

• Electronic Devices 100%
• High Efficiency 100%
• Monolithic Integration 100%
• Thermal Resistance 66%
• Densification 33%
• Close Proximity 33%
• Electronic System 33%
• Electrical Conductivity 33%
• Thermal Interface Materials 33%
• Existing Technology 33%
• Temperature Fluctuation 33%
• Electrical System 33%
• Conformal Coating 33%
• Gallium Nitride 33%
• Resistance Fluctuations 33%
• Heat Temperature 33%
• Base Metals 33%
• Thermal Heat 33%
• Cooling Performance 33%
• Chloro 33%
• Insulating Layer 33%
• Power Transistors 33%
• Xylylene 33%
• Heat Spreader 33%
• Temperature Stabilization 33%
• Heat Spreading 33%
• Electrification 33%
• Heat Generating 33%
• Thermal Management Technology 33%
• Parylene C 33%
• Electrical Insulating 33%

Material Science

• Heat Resistance 100%
• Transistor 50%
• Electrical Conductivity 50%
• Gallium Nitride 50%
• Interface (Material) 50%