Hierarchical patterns with sub-20 nm pattern fidelity: Via block copolymer self-assembly and soft nanotransfer printing

Helen Tran, Harrison M. Bergman, Kaia R. Parenti, Arend van der Zande, Cory R. Dean, Luis M. Campos

Research output: Contribution to journalArticle

Abstract

We describe the development of a technique to transfer micrometer patterns of organic thin films with sub-50 nm edge resolution and sub-20 nm pattern fidelity. Large-area transfer of homopolymers, diblock copolymers, and small molecules films is demonstrated, and extended to multitudes of different shapes. Moreover, this technique is amenable to sequential printing (i.e. multilayer stacking) and can be integrated with 2D atomic crystals. This high-fidelity pattern transfer work has broad scope for potential uses from the construction of van der Waals heterostructures interfaced with self-assembled block copolymer thin films to the development of platforms to investigate the influence of hierarchical patterning on cell differentiation.

Original languageEnglish (US)
Pages (from-to)3194-3200
Number of pages7
JournalPolymer Chemistry
Volume10
Issue number23
DOIs
StatePublished - Jun 21 2019

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Printing
Self assembly
Block copolymers
Cell Differentiation
Thin films
Homopolymerization
Heterojunctions
Multilayers
Crystals
Molecules

ASJC Scopus subject areas

  • Bioengineering
  • Biochemistry
  • Polymers and Plastics
  • Organic Chemistry

Cite this

Hierarchical patterns with sub-20 nm pattern fidelity : Via block copolymer self-assembly and soft nanotransfer printing. / Tran, Helen; Bergman, Harrison M.; Parenti, Kaia R.; van der Zande, Arend; Dean, Cory R.; Campos, Luis M.

In: Polymer Chemistry, Vol. 10, No. 23, 21.06.2019, p. 3194-3200.

Research output: Contribution to journalArticle

Tran, Helen ; Bergman, Harrison M. ; Parenti, Kaia R. ; van der Zande, Arend ; Dean, Cory R. ; Campos, Luis M. / Hierarchical patterns with sub-20 nm pattern fidelity : Via block copolymer self-assembly and soft nanotransfer printing. In: Polymer Chemistry. 2019 ; Vol. 10, No. 23. pp. 3194-3200.
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