Hierarchical Partitioning-Based Interchip Redistribution Layer Routing for Fan-Out Wafer-Level Packaging
- Haoyang Xu
- , Xing Huang
- , Zhen Zhuang
- , Zhiwen Yu
- , Bin Guo
- , Kai Yuan Chao
- , Bei Yu
- , Tsung Yi Ho
- , Martin D.F. Wong
Research output: Contribution to journal › Article › peer-review