@inproceedings{e295754d5a9f44e685ad08d2ba9c94f9,
title = "Hierarchical modeling and scalable algorithms for in-situ characterization of 3D IC packages",
abstract = "The objective of this work is to investigate high-resolution and high-performance computational methods for the first-principles analysis of in-situ product-level integrated circuit (IC) packages. The novelties and key technical approaches of the proposed work include: (i) a scalable geometry-based domain decomposition (DD) method to conquer the geometric complexity of physical domain, which leads to quasi-optimal convergence that is provably scalable for multi-scale objects. Moreover, it results in parallel and scalable computational algorithms to reduce the time complexity via high performance computing facilities; (ii) a hierarchical multi-scale simulator for high-definition IC package systems, in which the technical ingredients include a skeleton-based multi-region multi-solver method and a variational macro-micro analysis for multi-scale modeling. The capability and benefits of the algorithms are explored and illustrated through several real-world 3D IC package applications.",
author = "Yang Shao and Shu Wang and Zhen Peng",
year = "2016",
month = may,
day = "4",
doi = "10.1109/ROPACES.2016.7465410",
language = "English (US)",
series = "2016 IEEE/ACES International Conference on Wireless Information Technology, ICWITS 2016 and System and Applied Computational Electromagnetics, ACES 2016 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2016 IEEE/ACES International Conference on Wireless Information Technology, ICWITS 2016 and System and Applied Computational Electromagnetics, ACES 2016 - Proceedings",
address = "United States",
note = "IEEE/ACES International Conference on Wireless Information Technology, ICWITS 2016 and System and Applied Computational Electromagnetics, ACES 2016 ; Conference date: 13-03-2016 Through 17-03-2016",
}