TY - GEN
T1 - Hierarchical modeling and scalable algorithms for in-situ characterization of 3D IC packages
AU - Shao, Yang
AU - Wang, Shu
AU - Peng, Zhen
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/5/4
Y1 - 2016/5/4
N2 - The objective of this work is to investigate high-resolution and high-performance computational methods for the first-principles analysis of in-situ product-level integrated circuit (IC) packages. The novelties and key technical approaches of the proposed work include: (i) a scalable geometry-based domain decomposition (DD) method to conquer the geometric complexity of physical domain, which leads to quasi-optimal convergence that is provably scalable for multi-scale objects. Moreover, it results in parallel and scalable computational algorithms to reduce the time complexity via high performance computing facilities; (ii) a hierarchical multi-scale simulator for high-definition IC package systems, in which the technical ingredients include a skeleton-based multi-region multi-solver method and a variational macro-micro analysis for multi-scale modeling. The capability and benefits of the algorithms are explored and illustrated through several real-world 3D IC package applications.
AB - The objective of this work is to investigate high-resolution and high-performance computational methods for the first-principles analysis of in-situ product-level integrated circuit (IC) packages. The novelties and key technical approaches of the proposed work include: (i) a scalable geometry-based domain decomposition (DD) method to conquer the geometric complexity of physical domain, which leads to quasi-optimal convergence that is provably scalable for multi-scale objects. Moreover, it results in parallel and scalable computational algorithms to reduce the time complexity via high performance computing facilities; (ii) a hierarchical multi-scale simulator for high-definition IC package systems, in which the technical ingredients include a skeleton-based multi-region multi-solver method and a variational macro-micro analysis for multi-scale modeling. The capability and benefits of the algorithms are explored and illustrated through several real-world 3D IC package applications.
UR - http://www.scopus.com/inward/record.url?scp=84973537718&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84973537718&partnerID=8YFLogxK
U2 - 10.1109/ROPACES.2016.7465410
DO - 10.1109/ROPACES.2016.7465410
M3 - Conference contribution
AN - SCOPUS:84973537718
T3 - 2016 IEEE/ACES International Conference on Wireless Information Technology, ICWITS 2016 and System and Applied Computational Electromagnetics, ACES 2016 - Proceedings
BT - 2016 IEEE/ACES International Conference on Wireless Information Technology, ICWITS 2016 and System and Applied Computational Electromagnetics, ACES 2016 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE/ACES International Conference on Wireless Information Technology, ICWITS 2016 and System and Applied Computational Electromagnetics, ACES 2016
Y2 - 13 March 2016 through 17 March 2016
ER -