Hierarchical electromigration reliability diagnosis for VLSI interconnects

Chin Chi Teng, Yi Kan Cheng, Elyse Rosenbaum, Sung Mo Kang

Research output: Contribution to journalConference article

Abstract

In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (iTEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem.

Original languageEnglish (US)
Pages (from-to)752-757
Number of pages6
JournalProceedings - Design Automation Conference
StatePublished - Jan 1 1996
EventProceedings of the 1996 33rd Annual Design Automation Conference - Las Vegas, NV, USA
Duration: Jun 3 1996Jun 7 1996

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

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