Hierarchical electromigration reliability diagnosis for VLSI interconnects

Chin Chi Teng, Yi Kan Cheng, Elyse Rosenbaum, Sung Mo Kang

Research output: Contribution to journalConference article

Abstract

In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (iTEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem.

Original languageEnglish (US)
Pages (from-to)752-757
Number of pages6
JournalProceedings - Design Automation Conference
StatePublished - Jan 1 1996
EventProceedings of the 1996 33rd Annual Design Automation Conference - Las Vegas, NV, USA
Duration: Jun 3 1996Jun 7 1996

Fingerprint

Electromigration
Computer aided design
Networks (circuits)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

Cite this

Hierarchical electromigration reliability diagnosis for VLSI interconnects. / Teng, Chin Chi; Cheng, Yi Kan; Rosenbaum, Elyse; Kang, Sung Mo.

In: Proceedings - Design Automation Conference, 01.01.1996, p. 752-757.

Research output: Contribution to journalConference article

@article{31c5b362df3d4e9191a9fd2f89e466d6,
title = "Hierarchical electromigration reliability diagnosis for VLSI interconnects",
abstract = "In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (iTEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem.",
author = "Teng, {Chin Chi} and Cheng, {Yi Kan} and Elyse Rosenbaum and Kang, {Sung Mo}",
year = "1996",
month = "1",
day = "1",
language = "English (US)",
pages = "752--757",
journal = "Proceedings - Design Automation Conference",
issn = "0738-100X",

}

TY - JOUR

T1 - Hierarchical electromigration reliability diagnosis for VLSI interconnects

AU - Teng, Chin Chi

AU - Cheng, Yi Kan

AU - Rosenbaum, Elyse

AU - Kang, Sung Mo

PY - 1996/1/1

Y1 - 1996/1/1

N2 - In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (iTEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem.

AB - In this paper, we present a hierarchical reliability-driven CAD system for the design of electromigration resistant circuits. The top of the hierarchy aims at quickly identifying those critical interconnects with potential electromigration reliability problems. Then the detailed electromigration analysis of critical interconnects is carried out by an accurate and computationally efficient simulation tool (iTEM). This top-down approach provides a feasible solution to the complicated electromigration diagnosis problem.

UR - http://www.scopus.com/inward/record.url?scp=0029705519&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029705519&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0029705519

SP - 752

EP - 757

JO - Proceedings - Design Automation Conference

JF - Proceedings - Design Automation Conference

SN - 0738-100X

ER -