Heterogeneous Integration for Silicon Photonic Systems: Challenges and Approaches

John M. Dallesasse, John A. Carlson, Manaav Ganjoo, Leah Espenhahn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The promise of silicon integrated circuits with their electronic or photonic functionality enhanced via heterogeneous integration has motivated significant work in understanding and overcoming the barriers to realizing such an IC. Additional hurdles must be overcome when integrating devices that are highly sensitive to temperature variation such as semiconductor lasers. Challenges in the heterogeneous integration process will be reviewed, and approaches for heterogeneous integration that have the potential to enable silicon ICs with enhanced functionality will be discussed in the context of integrated photonic systems.

Original languageEnglish (US)
Title of host publication2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728181769
DOIs
StatePublished - Apr 8 2021
Event5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 - Chengdu, China
Duration: Apr 8 2021Apr 11 2021

Publication series

Name2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021

Conference

Conference5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021
Country/TerritoryChina
CityChengdu
Period4/8/214/11/21

Keywords

  • CMOS
  • Heterogeneous Integration
  • Manufacturing
  • Silicon Photonics

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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