@inproceedings{1197b68652d94a92af837f61a68c0736,
title = "Heterogeneous Integration for Silicon Photonic Systems: Challenges and Approaches",
abstract = "The promise of silicon integrated circuits with their electronic or photonic functionality enhanced via heterogeneous integration has motivated significant work in understanding and overcoming the barriers to realizing such an IC. Additional hurdles must be overcome when integrating devices that are highly sensitive to temperature variation such as semiconductor lasers. Challenges in the heterogeneous integration process will be reviewed, and approaches for heterogeneous integration that have the potential to enable silicon ICs with enhanced functionality will be discussed in the context of integrated photonic systems.",
keywords = "CMOS, Heterogeneous Integration, Manufacturing, Silicon Photonics",
author = "Dallesasse, {John M.} and Carlson, {John A.} and Manaav Ganjoo and Leah Espenhahn",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021 ; Conference date: 08-04-2021 Through 11-04-2021",
year = "2021",
month = apr,
day = "8",
doi = "10.1109/EDTM50988.2021.9420896",
language = "English (US)",
series = "2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 5th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2021",
address = "United States",
}