TY - GEN
T1 - Heat transfer between a heated microcantilever and the substrate
AU - Park, Keunhan
AU - Cross, Graham L W
AU - Zhang, Zhuomin M.
AU - King, William Paul
PY - 2007
Y1 - 2007
N2 - This paper describes the heat transfer from a heated microcantilever to the substrate and the resultant temperature distributions. A four-point probe platinum resistive thermometer having a 140 nm lateral resolution has been fabricated on the SiO2-coated silicon substrate. The estimated temperature coefficient of resistance (TCR) of the thermometer is 0.0011 K -1, approximately one third of the bulk value. When the heated cantilever scans over the thermometer, up to 70 % of the cantilever power is transferred to the substrate through the air, heating up the substrate. The maximum substrate temperature rise measured with the thermometer is around 7 K. From the force-displacement experiment, the effective contact thermal conductance was estimated to be around 40 ± 20 nW/K. The obtained results will help further understanding of thermal behavior of the heated cantilever during the scanning and its effect on the substrate.
AB - This paper describes the heat transfer from a heated microcantilever to the substrate and the resultant temperature distributions. A four-point probe platinum resistive thermometer having a 140 nm lateral resolution has been fabricated on the SiO2-coated silicon substrate. The estimated temperature coefficient of resistance (TCR) of the thermometer is 0.0011 K -1, approximately one third of the bulk value. When the heated cantilever scans over the thermometer, up to 70 % of the cantilever power is transferred to the substrate through the air, heating up the substrate. The maximum substrate temperature rise measured with the thermometer is around 7 K. From the force-displacement experiment, the effective contact thermal conductance was estimated to be around 40 ± 20 nW/K. The obtained results will help further understanding of thermal behavior of the heated cantilever during the scanning and its effect on the substrate.
KW - Atomic force microscope
KW - Heated microcantilever
KW - Micro/nanoscale heat transfer
KW - Nanoscale thermometer
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U2 - 10.1115/HT2007-32536
DO - 10.1115/HT2007-32536
M3 - Conference contribution
AN - SCOPUS:43449111506
SN - 0791842746
SN - 9780791842744
T3 - 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
SP - 805
EP - 815
BT - 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
T2 - 2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
Y2 - 8 July 2007 through 12 July 2007
ER -