Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters

Nathan Pallo; Thomas Foulkes; Tomas Modeer; Edwin Fonkwe; Petar Gartner; Robert C.N. Pilawa-Podgurski

doi:10.1109/PECI.2017.7935758

Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters

Nathan Pallo, Thomas Foulkes, Tomas Modeer, Edwin Fonkwe, Petar Gartner, Robert C.N. Pilawa-Podgurski

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The multilevel flying capacitor topology is a promising technology for future electric aircraft, where high specific power density power converters are required. Hardware-in-the loop co-design can improve design throughput as more complex implementations of this technology are developed. This paper presents a comparison of hardware-in-the-loop emulation and hardware prototype results for 3-, 5- and 7-level flying capacitor converters. The fidelity of the emulation is investigated for both dc-dc and inverter operation and it is shown that, within certain limits, the converter operation can be emulated closely.

Original language	English (US)
Title of host publication	2017 IEEE Power and Energy Conference at Illinois, PECI 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781509055517
DOIs	https://doi.org/10.1109/PECI.2017.7935758
State	Published - May 30 2017
Event	2017 IEEE Power and Energy Conference at Illinois, PECI 2017 - Urbana, United States Duration: Feb 23 2017 → Feb 24 2017

Publication series

Name	2017 IEEE Power and Energy Conference at Illinois, PECI 2017

Other

Other	2017 IEEE Power and Energy Conference at Illinois, PECI 2017
Country	United States
City	Urbana
Period	2/23/17 → 2/24/17

ASJC Scopus subject areas

Energy Engineering and Power Technology
Electrical and Electronic Engineering

Access to Document

10.1109/PECI.2017.7935758

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Cite this

Pallo, N., Foulkes, T., Modeer, T., Fonkwe, E., Gartner, P., & Pilawa-Podgurski, R. C. N. (2017). Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters. In 2017 IEEE Power and Energy Conference at Illinois, PECI 2017 [7935758] (2017 IEEE Power and Energy Conference at Illinois, PECI 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PECI.2017.7935758

Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters. / Pallo, Nathan; Foulkes, Thomas; Modeer, Tomas; Fonkwe, Edwin; Gartner, Petar; Pilawa-Podgurski, Robert C.N.

2017 IEEE Power and Energy Conference at Illinois, PECI 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7935758 (2017 IEEE Power and Energy Conference at Illinois, PECI 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Pallo, N, Foulkes, T, Modeer, T, Fonkwe, E, Gartner, P & Pilawa-Podgurski, RCN 2017, Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters. in 2017 IEEE Power and Energy Conference at Illinois, PECI 2017., 7935758, 2017 IEEE Power and Energy Conference at Illinois, PECI 2017, Institute of Electrical and Electronics Engineers Inc., 2017 IEEE Power and Energy Conference at Illinois, PECI 2017, Urbana, United States, 2/23/17. https://doi.org/10.1109/PECI.2017.7935758

Pallo N, Foulkes T, Modeer T, Fonkwe E, Gartner P, Pilawa-Podgurski RCN. Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters. In 2017 IEEE Power and Energy Conference at Illinois, PECI 2017. Institute of Electrical and Electronics Engineers Inc. 2017. 7935758. (2017 IEEE Power and Energy Conference at Illinois, PECI 2017). https://doi.org/10.1109/PECI.2017.7935758

Pallo, Nathan ; Foulkes, Thomas ; Modeer, Tomas ; Fonkwe, Edwin ; Gartner, Petar ; Pilawa-Podgurski, Robert C.N. / Hardware-in-the-loop co-design testbed for flying capacitor multilevel converters. 2017 IEEE Power and Energy Conference at Illinois, PECI 2017. Institute of Electrical and Electronics Engineers Inc., 2017. (2017 IEEE Power and Energy Conference at Illinois, PECI 2017).

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