@inproceedings{c6b370491fc0498d99f395d7d55f1a33,
title = "Growth kinetics and microstructural evolution of Cu-Sn intermetallic compounds on different Cu substrates during thermal aging",
abstract = "The microstructure of the eutectic SnBi/Cu interface was investigated by transmission electron microscopy (TEM). Insitu and ex-situ thermal aging were conducted to study the nucleation and growth of Cu3Sn and Cu 6Sn5 on both polycrystalline and single crystalline Cu substrates. The growth kinetic analysis showed that although the growth of total IMCs (Cu3Sn + Cu6Sn5) was similar on single and polycrystalline Cu substrates, the Cu3Sn grew faster on polycrystalline Cu substrate than that on single crystal Cu substrate, while Cu6Sn5 grew slowly on polycrystalline Cu during thermal aging.",
author = "Liu, {Z. Q.} and Shang, {P. J.} and Li, {D. X.} and Shang, {J. K.}",
year = "2009",
doi = "10.1109/ICEPT.2009.5270685",
language = "English (US)",
isbn = "9781424446599",
series = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",
pages = "569--571",
booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",
note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",
}