Growing crack along elastic/creeping bi-material interface

M Taher A Saif, Chung Yuen Hui

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The stress field near the tip of a plane strain crack, growing quasi-statically along an elastic/elastic power law creeping bi-material interface, is studied. Both the elastic and creeping materials are incompressible. It is found that when n≥3, where n is the power law creeping exponent, the leading order term of the stress field has a separable form, and the amplitude of the field is determined by current crack tip velocity and material parameters. Furthermore, the solution exhibits only two modes, one of which is close to pure mode I and the other one is close to pure mode II. They approach pure modes I and II as the value of n approaches 3. Thus, arbitrary mode mixity cannot be prescribed, and the near tip field is independent of the far field loading conditions. When n<3, the near tip field is similar to that of a crack along the interface of two linear elastic materials.

Original languageEnglish (US)
Title of host publicationComposite Materials
EditorsWalter F. Jones
PublisherPubl by ASME
Pages65-76
Number of pages12
Volume37
ISBN (Print)0791812502
StatePublished - 1993
Externally publishedYes
EventProceedings of the 1993 ASME Winter Annual Meeting - New Orleans, LA, USA
Duration: Nov 28 1993Dec 3 1993

Other

OtherProceedings of the 1993 ASME Winter Annual Meeting
CityNew Orleans, LA, USA
Period11/28/9312/3/93

ASJC Scopus subject areas

  • Space and Planetary Science
  • Mechanical Engineering

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  • Cite this

    Saif, M. T. A., & Hui, C. Y. (1993). Growing crack along elastic/creeping bi-material interface. In W. F. Jones (Ed.), Composite Materials (Vol. 37, pp. 65-76). Publ by ASME.