Grazing incidence ion beams for reducing LER

C. R M Struck, M. J. Neumann, R. Raju, R. L. Bristol, David N Ruzic

Research output: Contribution to journalConference article

Abstract

As semiconductor feature sizes continue to decrease, the phenomena of line edge roughness (LER) becomes more disruptive in chip manufacturing. While many efforts are underway to decrease LER from the photoresist, post-develop smoothing techniques may be required to continue shrinking chip features economically. This paper reports on one such method employing the use of an ion beam at grazing incidence along the features. This method smooths relatively long spatial length LER, a potential advantage over other smoothing techniques that focus on just small-scale LER. LER reduction numbers using Ne and Ar beams are reported at both short and long spatial wavelength. Variables include beam energy, length of time and angular dependence. LER measurements are taken using Hitachi image analysis software on top-down analytical SEM measurements. Line profile data are taken from cross sectional SEM photographs. Tests have achieved a reduction in LER from 9.8±0.67 nm to 5.5±0.86 nm for 45 nm 1:1 lines using an Ar beam at 500 eV for 6 s at an 85° angle of incidence. A reduction from 10.1±1.07 nm to 6±1.02 nm was shown using an Ar beam at 1000 eV for 4 s at a 60° angle of incidence.

Original languageEnglish (US)
Article number71402P
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume7140
DOIs
StatePublished - Dec 1 2008
EventLithography Asia 2008 - Taipei, Taiwan, Province of China
Duration: Nov 4 2008Nov 6 2008

Fingerprint

grazing incidence
Roughness
Ion beams
Incidence
roughness
Surface roughness
ion beams
Line
smoothing
Smoothing Techniques
Roughness measurement
incidence
chips
Scanning electron microscopy
Chip
Photoresists
Continue
scanning electron microscopy
Reduction number
Image analysis

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Grazing incidence ion beams for reducing LER. / Struck, C. R M; Neumann, M. J.; Raju, R.; Bristol, R. L.; Ruzic, David N.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 7140, 71402P, 01.12.2008.

Research output: Contribution to journalConference article

Struck, C. R M ; Neumann, M. J. ; Raju, R. ; Bristol, R. L. ; Ruzic, David N. / Grazing incidence ion beams for reducing LER. In: Proceedings of SPIE - The International Society for Optical Engineering. 2008 ; Vol. 7140.
@article{dee22886dd0b416abe1c4e3cdaaebe65,
title = "Grazing incidence ion beams for reducing LER",
abstract = "As semiconductor feature sizes continue to decrease, the phenomena of line edge roughness (LER) becomes more disruptive in chip manufacturing. While many efforts are underway to decrease LER from the photoresist, post-develop smoothing techniques may be required to continue shrinking chip features economically. This paper reports on one such method employing the use of an ion beam at grazing incidence along the features. This method smooths relatively long spatial length LER, a potential advantage over other smoothing techniques that focus on just small-scale LER. LER reduction numbers using Ne and Ar beams are reported at both short and long spatial wavelength. Variables include beam energy, length of time and angular dependence. LER measurements are taken using Hitachi image analysis software on top-down analytical SEM measurements. Line profile data are taken from cross sectional SEM photographs. Tests have achieved a reduction in LER from 9.8±0.67 nm to 5.5±0.86 nm for 45 nm 1:1 lines using an Ar beam at 500 eV for 6 s at an 85° angle of incidence. A reduction from 10.1±1.07 nm to 6±1.02 nm was shown using an Ar beam at 1000 eV for 4 s at a 60° angle of incidence.",
author = "Struck, {C. R M} and Neumann, {M. J.} and R. Raju and Bristol, {R. L.} and Ruzic, {David N}",
year = "2008",
month = "12",
day = "1",
doi = "10.1117/12.804692",
language = "English (US)",
volume = "7140",
journal = "Proceedings of SPIE - The International Society for Optical Engineering",
issn = "0277-786X",
publisher = "SPIE",

}

TY - JOUR

T1 - Grazing incidence ion beams for reducing LER

AU - Struck, C. R M

AU - Neumann, M. J.

AU - Raju, R.

AU - Bristol, R. L.

AU - Ruzic, David N

PY - 2008/12/1

Y1 - 2008/12/1

N2 - As semiconductor feature sizes continue to decrease, the phenomena of line edge roughness (LER) becomes more disruptive in chip manufacturing. While many efforts are underway to decrease LER from the photoresist, post-develop smoothing techniques may be required to continue shrinking chip features economically. This paper reports on one such method employing the use of an ion beam at grazing incidence along the features. This method smooths relatively long spatial length LER, a potential advantage over other smoothing techniques that focus on just small-scale LER. LER reduction numbers using Ne and Ar beams are reported at both short and long spatial wavelength. Variables include beam energy, length of time and angular dependence. LER measurements are taken using Hitachi image analysis software on top-down analytical SEM measurements. Line profile data are taken from cross sectional SEM photographs. Tests have achieved a reduction in LER from 9.8±0.67 nm to 5.5±0.86 nm for 45 nm 1:1 lines using an Ar beam at 500 eV for 6 s at an 85° angle of incidence. A reduction from 10.1±1.07 nm to 6±1.02 nm was shown using an Ar beam at 1000 eV for 4 s at a 60° angle of incidence.

AB - As semiconductor feature sizes continue to decrease, the phenomena of line edge roughness (LER) becomes more disruptive in chip manufacturing. While many efforts are underway to decrease LER from the photoresist, post-develop smoothing techniques may be required to continue shrinking chip features economically. This paper reports on one such method employing the use of an ion beam at grazing incidence along the features. This method smooths relatively long spatial length LER, a potential advantage over other smoothing techniques that focus on just small-scale LER. LER reduction numbers using Ne and Ar beams are reported at both short and long spatial wavelength. Variables include beam energy, length of time and angular dependence. LER measurements are taken using Hitachi image analysis software on top-down analytical SEM measurements. Line profile data are taken from cross sectional SEM photographs. Tests have achieved a reduction in LER from 9.8±0.67 nm to 5.5±0.86 nm for 45 nm 1:1 lines using an Ar beam at 500 eV for 6 s at an 85° angle of incidence. A reduction from 10.1±1.07 nm to 6±1.02 nm was shown using an Ar beam at 1000 eV for 4 s at a 60° angle of incidence.

UR - http://www.scopus.com/inward/record.url?scp=62449251334&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=62449251334&partnerID=8YFLogxK

U2 - 10.1117/12.804692

DO - 10.1117/12.804692

M3 - Conference article

AN - SCOPUS:62449251334

VL - 7140

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

M1 - 71402P

ER -