A finite element formulation and solution of a set of coupled conductive heat and diffusive moisture transfer equations to improve grain drying simulation of axisymmetric bodies is presented. The model considers the temperature and moisture dependence of the diffusion coefficient, thermal conductivity, and specific heat. It assumes that moisture diffuses to the outer boundaries of the kernel in liquid form and that evaporation takes place only at the surface of grain. Application was made to drying of a barley kernel and predicted results agreed well with the experimental data. The simulated temperature and moisture profiles and gradients are directly usable for stress cracking analyses of grain. The results of the finite element analysis can be used for grain quality evaluation and drying simulation studies.
|Original language||English (US)|
|Number of pages||9|
|Journal||Transactions of the American Society of Agricultural Engineers|
|State||Published - Nov 1990|
ASJC Scopus subject areas
- Agricultural and Biological Sciences (miscellaneous)