Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes

Aosheng Rong, Andreas C Cangellaris

Research output: Contribution to conferencePaper

Abstract

This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.

Original languageEnglish (US)
Pages225-228
Number of pages4
StatePublished - Dec 1 2001
EventIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States
Duration: Oct 29 2001Oct 31 2001

Other

OtherIEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
CountryUnited States
CityCambridge, MA
Period10/29/0110/31/01

    Fingerprint

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Rong, A., & Cangellaris, A. C. (2001). Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes. 225-228. Paper presented at IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, Cambridge, MA, United States.