Abstract
A generalized impedance boundary condition is developed to rigorously model on-chip interconnects in the full-wave surface integral equation by a two-region formulation. It is a combination of the electric-field integral equation for the exterior region and the magnetic-field integral equation for the interior conductive region. The skin effect is, therefore, well captured. A novel integration technique is proposed to evaluate the Green's function integrals in the conductive medium. Towards tackling large-scale problems, the mixed-form fast multipole algorithm and the multifrontal method are incorporated. A new scheme of the loop-tree decomposition is also used to alleviate the low-frequency breakdown for the formulation. Numerical examples show the accuracy and reduced computation cost.
Original language | English (US) |
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Pages (from-to) | 2354-2364 |
Number of pages | 11 |
Journal | IEEE Transactions on Microwave Theory and Techniques |
Volume | 55 |
Issue number | 11 |
DOIs | |
State | Published - Nov 2007 |
Externally published | Yes |
Keywords
- Full-wave solver
- Generalized impedance boundary condition
- Impedance boundary condition
- Interconnects
- Loop tree
- Mixed-form fast multipole algorithm
- Skin effect
- Surface integral equation
ASJC Scopus subject areas
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering