General-purpose SPICE model for multiconductor transmission lines

Mustafa Celik, Andreas C. Cangellaris

Research output: Contribution to conferencePaper

Abstract

This paper presents a new model for the simulation of signal propagation in dispersive, coupled, uniform/nonuniform transmission lines using SPICE. Numerical results are used to demonstrate the validity and versatility of this new model.

Original languageEnglish (US)
Pages155-158
Number of pages4
StatePublished - Dec 1 1996
Externally publishedYes
EventProceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA
Duration: Oct 28 1996Oct 30 1996

Other

OtherProceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging
CityNapa Valley, CA, USA
Period10/28/9610/30/96

Fingerprint

SPICE
Electric lines

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Celik, M., & Cangellaris, A. C. (1996). General-purpose SPICE model for multiconductor transmission lines. 155-158. Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .

General-purpose SPICE model for multiconductor transmission lines. / Celik, Mustafa; Cangellaris, Andreas C.

1996. 155-158 Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .

Research output: Contribution to conferencePaper

Celik, M & Cangellaris, AC 1996, 'General-purpose SPICE model for multiconductor transmission lines' Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, 10/28/96 - 10/30/96, pp. 155-158.
Celik M, Cangellaris AC. General-purpose SPICE model for multiconductor transmission lines. 1996. Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .
Celik, Mustafa ; Cangellaris, Andreas C. / General-purpose SPICE model for multiconductor transmission lines. Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .4 p.
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