Abstract
This paper presents a new model for the simulation of signal propagation in dispersive, coupled, uniform/nonuniform transmission lines using SPICE. Numerical results are used to demonstrate the validity and versatility of this new model.
Original language | English (US) |
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Pages | 155-158 |
Number of pages | 4 |
State | Published - 1996 |
Externally published | Yes |
Event | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA Duration: Oct 28 1996 → Oct 30 1996 |
Other
Other | Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging |
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City | Napa Valley, CA, USA |
Period | 10/28/96 → 10/30/96 |
ASJC Scopus subject areas
- General Engineering