Abstract
In this letter, we report successful fabrication of Germanium n-MOSFETs on lightly doped Ge substrates with a thin HfO2 dielectric (equivalent oxide thickness ∼ 10.8 Å) and TaN gate electrode. The highest peak mobility (330 cm2/V·s) and saturated drive current (130 μA/sq at Vg-Vt = 1.5 V) have been demonstrated for n-channel bulk Ge MOSFETs with an ultrathin dielectric. As compared to Si control devices, 2.5× enhancement of peak mobility has been achieved. The poor performance of Ge n-MOSFET devices reported recently and its mechanism have been investigated. Impurity induced structural defects are believed to be responsible for the severe degradation.
Original language | English (US) |
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Pages (from-to) | 175-178 |
Number of pages | 4 |
Journal | IEEE Electron Device Letters |
Volume | 27 |
Issue number | 3 |
DOIs | |
State | Published - Mar 2006 |
Externally published | Yes |
Keywords
- Ammonia treatment
- Germanium (Ge)
- Hafnium oxide
- High-κ dielectric
- MOSFET
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering