Gap size effects on the shear strength of Sn/Cu and Sn/FeNi solder joints

Cai Chen, Lei Zhang, Jiaxi Zhao, Lihua Cao, J. K. Shang

Research output: Contribution to journalArticlepeer-review


The effect of the gap size on the shear strength of a solder joint was investigated in both Sn/Cu and Sn/FeNi lap solder joints by varying the gap size from 20 μm to 300 μm. In the Sn/FeNi joints, the shear strength remained relatively constant, around 14 MPa, independent of the gap size. In contrast, the shear strength of the Sn/Cu joint decreased about 20% from 25 MPa to 20 MPa. The decrease was shown to result from Cu 6Sn 5 precipitation in the thicker Sn/Cu joint, which was absent in the thinner joints.

Original languageEnglish (US)
Pages (from-to)2487-2494
Number of pages8
JournalJournal of Electronic Materials
Issue number9
StatePublished - Sep 2012
Externally publishedYes


  • Solder
  • microstructure
  • shear strength
  • size effect

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry


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