Abstract
The effect of the gap size on the shear strength of a solder joint was investigated in both Sn/Cu and Sn/FeNi lap solder joints by varying the gap size from 20 μm to 300 μm. In the Sn/FeNi joints, the shear strength remained relatively constant, around 14 MPa, independent of the gap size. In contrast, the shear strength of the Sn/Cu joint decreased about 20% from 25 MPa to 20 MPa. The decrease was shown to result from Cu 6Sn 5 precipitation in the thicker Sn/Cu joint, which was absent in the thinner joints.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 2487-2494 |
| Number of pages | 8 |
| Journal | Journal of Electronic Materials |
| Volume | 41 |
| Issue number | 9 |
| DOIs | |
| State | Published - Sep 2012 |
| Externally published | Yes |
Keywords
- Solder
- microstructure
- shear strength
- size effect
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry