Abstract
Two most widely used techniques to fabricate GaN p-n structures are: ion-implantation and ICP-RIE etching followed by regrowth. However, both the techniques inextricably suffer from higher leakage current due to defects and leakage paths created, while the latter introduces reduction in current density in the damaged areas. These high-defect yielding techniques can be avoided by using our PAMBE-SAG protocol developed earlier. In this paper we designed and successfully demonstrated the PI-MPS diode structures using the PAMBE-SAG methodology for the first time.
Original language | English (US) |
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State | Published - 2019 |
Event | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 - Minneapolis, United States Duration: Apr 29 2019 → May 2 2019 |
Conference
Conference | 2019 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2019 |
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Country/Territory | United States |
City | Minneapolis |
Period | 4/29/19 → 5/2/19 |
Keywords
- ICP-RIE
- Ion-implantation
- Leakage current
- PAMBE-SAG
- PI-MPS
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering