GaN Bootstrapping Amplifier IC Operating at up to 800 °C Temperature

Yixin Xiong, Ajay K. Visvkarma, Rian Guan, Nathan S. Banner, Chan-Wen Chiu, Xiaojun Zheng, Suzanne E. Mohney, Thomas N. Jackson, Rongming Chu

Research output: Contribution to journalArticlepeer-review

Abstract

A gallium nitride bootstrapping amplifier integrated circuit is demonstrated for high-temperature applications. The amplifier leverages bootstrapping gainboosting technology and incorporates five monolithically integrated depletion-mode gallium nitride high electron mobility transistors, enabling an operation temperature up to 800 °C in N2 environment. Those transistors feature a threshold voltage of approximately −2 V. Under a gate-to-source voltage of 5 V, the on-state current density decreased from 167 mA/mm at 25 °C to 45 mA/mm at 800 °C. At 25 °C, the amplifier exhibits a DC gain of 26.3 dB with a unity gain frequency of 8.9 MHz. At 800 °C, the amplifier delivers a DC gain of 31 dB and a unity gain frequency of 1.4 MHz. In addition, no significant degradation was observed after holding the transistor and amplifier unbiased for an hour at 800 °C. This amplifier integrated circuit demonstrates the competitiveness of gallium nitride high electron mobility transistors as a promising technology for high-temperature electronics, up to 800 °C.
Original languageEnglish (US)
Article number11048918
Pages (from-to)1309-1312
Number of pages4
JournalIEEE Electron Device Letters
Volume46
Issue number8
Early online dateJun 24 2025
DOIs
StatePublished - Aug 2025
Externally publishedYes

Keywords

  • HEMTs
  • bootstrapping amplifier
  • gallium nitride
  • high temperature FETs
  • monolithic integration

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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