Fully coupled electrothermal simulation of large RRAM arrays in the 'thermal-house'

Da Wei Wang; Wenchao Chen; Wen Sheng Zhao; Guo Dong Zhu; Kai Kang; Pingqi Gao; Jose E. Schutt-Aine; Wen Yan Yin

doi:10.1109/ACCESS.2018.2888572

Fully coupled electrothermal simulation of large RRAM arrays in the 'thermal-house'

Da Wei Wang, Wenchao Chen, Wen Sheng Zhao, Guo Dong Zhu, Kai Kang, Pingqi Gao, Jose E. Schutt-Aine, Wen Yan Yin

Research output: Contribution to journal › Article › peer-review

Abstract

Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of 'thermal-house' structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.

Original language	English (US)
Article number	8580571
Pages (from-to)	3897-3908
Number of pages	12
Journal	IEEE Access
Volume	7
DOIs	https://doi.org/10.1109/ACCESS.2018.2888572
State	Published - 2019

Keywords

Electrothermal simulation
low power consumption
parallel simulator
resistive-switching random access memory (RRAM)
thermal crosstalk
thermal management
thermal-house

ASJC Scopus subject areas

General Computer Science
General Materials Science
General Engineering

Online availability

10.1109/ACCESS.2018.2888572

Library availability

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Cite this

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title = "Fully coupled electrothermal simulation of large RRAM arrays in the 'thermal-house'",

abstract = "Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of 'thermal-house' structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.",

keywords = "Electrothermal simulation, low power consumption, parallel simulator, resistive-switching random access memory (RRAM), thermal crosstalk, thermal management, thermal-house",

author = "Wang, {Da Wei} and Wenchao Chen and Zhao, {Wen Sheng} and Zhu, {Guo Dong} and Kai Kang and Pingqi Gao and Schutt-Aine, {Jose E.} and Yin, {Wen Yan}",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.",

year = "2019",

doi = "10.1109/ACCESS.2018.2888572",

language = "English (US)",

volume = "7",

pages = "3897--3908",

journal = "IEEE Access",

issn = "2169-3536",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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AU - Wang, Da Wei

AU - Chen, Wenchao

AU - Zhao, Wen Sheng

AU - Zhu, Guo Dong

AU - Kang, Kai

AU - Gao, Pingqi

AU - Schutt-Aine, Jose E.

AU - Yin, Wen Yan

PY - 2019

Y1 - 2019

N2 - Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of 'thermal-house' structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.

AB - Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of 'thermal-house' structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.

KW - Electrothermal simulation

KW - low power consumption

KW - parallel simulator

KW - resistive-switching random access memory (RRAM)

KW - thermal crosstalk

KW - thermal management

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Fully coupled electrothermal simulation of large RRAM arrays in the 'thermal-house'

Abstract

Keywords

ASJC Scopus subject areas

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