Abstract
Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite-element/integral-equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of frequency dependence of the inductance on pulse propagation is discussed.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 398-403 |
| Number of pages | 6 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| State | Published - 1989 |
| Externally published | Yes |
| Event | 39th Electronic Components - Houston, TX, USA Duration: May 22 1989 → May 24 1989 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering