Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems

Andreas C. Cangellaris; John L. Prince; Loizos P. Vakanas

doi:10.1109/33.52864

Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems

Andreas C. Cangellaris, John L. Prince, Loizos P. Vakanas

Research output: Contribution to journal › Article › peer-review

Abstract

Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite element integral equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is also discussed.

Original language	English (US)
Pages (from-to)	154-159
Number of pages	6
Journal	IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume	13
Issue number	1
DOIs	https://doi.org/10.1109/33.52864
State	Published - Mar 1990
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/33.52864

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Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems. / Cangellaris, Andreas C.; Prince, John L.; Vakanas, Loizos P.

In: IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 1, 03.1990, p. 154-159.

Research output: Contribution to journal › Article › peer-review

@article{98b1dc8f63824789ba7a2899793f8cb1,

title = "Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems",

abstract = "Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite element integral equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is also discussed.",

author = "Cangellaris, {Andreas C.} and Prince, {John L.} and Vakanas, {Loizos P.}",

note = "Funding Information: Manuscript received March l, 1989; revised September 15, 1989. This work was supported by the Semiconductor Research Corporation under the program “VLSI Packaging and Interconnection Research” under Grant SRC 88-MP-086. This paper was presented at the 39th Electronic Components Conference, Houston, TX, May 22-24, 1989.",

year = "1990",

month = mar,

doi = "10.1109/33.52864",

language = "English (US)",

volume = "13",

pages = "154--159",

journal = "IEEE Transactions on Components, Hybrids and Manufacturing Technology",

issn = "0148-6411",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "1",

}

TY - JOUR

T1 - Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems

AU - Cangellaris, Andreas C.

AU - Prince, John L.

AU - Vakanas, Loizos P.

N1 - Funding Information: Manuscript received March l, 1989; revised September 15, 1989. This work was supported by the Semiconductor Research Corporation under the program “VLSI Packaging and Interconnection Research” under Grant SRC 88-MP-086. This paper was presented at the 39th Electronic Components Conference, Houston, TX, May 22-24, 1989.

PY - 1990/3

Y1 - 1990/3

N2 - Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite element integral equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is also discussed.

AB - Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite element integral equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is also discussed.

UR - http://www.scopus.com/inward/record.url?scp=0025390066&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025390066&partnerID=8YFLogxK

U2 - 10.1109/33.52864

DO - 10.1109/33.52864

M3 - Article

AN - SCOPUS:0025390066

VL - 13

SP - 154

EP - 159

JO - IEEE Transactions on Components, Hybrids and Manufacturing Technology

JF - IEEE Transactions on Components, Hybrids and Manufacturing Technology

SN - 0148-6411

IS - 1

ER -

Frequency-Dependent Inductance and Resistance Calculation for Three-Dimensional Structures in High-Speed Interconnect Systems

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