Abstract
Frequency-dependent inductances and resistances of three-dimensional structures commonly encountered in modern electronic interconnections are calculated by a combined finite element integral equation method. The mathematical formulation and the numerical method of solution are discussed. Numerical results for microstrip bends and vias are presented. These results compare well with experiment. The effect of the frequency dependence of the inductance on pulse propagation is also discussed.
Original language | English (US) |
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Pages (from-to) | 154-159 |
Number of pages | 6 |
Journal | IEEE Transactions on Components, Hybrids, and Manufacturing Technology |
Volume | 13 |
Issue number | 1 |
DOIs | |
State | Published - Mar 1990 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Engineering(all)
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering