Abstract
An advanced regression scheme is proposed to analyze fine leak batch testing data of multiple MEMS packages. The scheme employs the forward-stepwise regression method to infer the information of leaky packages from a batch test data. The analysis predicts the number of leaky packages and the true leak rate of each leaky package in a progressive manner. The scheme is implemented successfully using an actual batch test data obtained from wafer-level hermetic MEMS packages. An error analysis is followed to define the applicable domain of the scheme. Advanced formulations are also suggested to extend the applicable domain.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 507-513 |
| Number of pages | 7 |
| Journal | Microelectronics Reliability |
| Volume | 50 |
| Issue number | 4 |
| DOIs | |
| State | Published - Apr 2010 |
| Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Safety, Risk, Reliability and Quality
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering