@article{72c1805665044037a6f3ac1c1119d2f5,
title = "Foreword Special Section on 'Evolving Trends in Electrical Modeling, Validation, and Signal and Power Integrity Analysis in Electronic Packaging and Systems'",
author = "Thomas Kuhler and Zhen Peng",
year = "2023",
month = oct,
day = "1",
doi = "10.1109/TCPMT.2023.3320328",
language = "English (US)",
volume = "13",
pages = "1531--1532",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "10",
}