@article{5d037896441e472aaa9cbefcde993690,
title = "Foreword Special Section on 'Advances in Electrical Modeling and Validation of Electronic Packaging and Systems'",
author = "Kemal Aygun and Xu Chen",
note = "Funding Information: Dr. Chen was a recipient of the Best Conference Paper Award at IEEE Electrical Design of Advanced Packaging and Systems in 2017. He was also a recipient of Raj Mittra Outstanding Research Award, Mavis Future Faculty Fellowship, U.S. National Committee for the International Union of Radio Science (USNC-URSI) Fellowship Grant Award, and others.",
year = "2021",
month = sep,
doi = "10.1109/TCPMT.2021.3106515",
language = "English (US)",
volume = "11",
pages = "1315--1316",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3950",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "9",
}