Foreword

José Schutt-Ainé, Madhavan Swaminathan

Research output: Contribution to journalEditorial

Original languageEnglish (US)
Article number7893093
Pages (from-to)iii
Journal2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
DOIs
StatePublished - Apr 5 2017
Event2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States
Duration: Dec 14 2016Dec 16 2016

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Modeling and Simulation

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