Foreword

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	7893093
Pages (from-to)	iii
Journal	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
DOIs	https://doi.org/10.1109/EDAPS.2016.7893093
State	Published - Apr 5 2017
Event	2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States Duration: Dec 14 2016 → Dec 16 2016

ASJC Scopus subject areas

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title = "Foreword",

author = "Jos{\'e} Schutt-Ain{\'e} and Madhavan Swaminathan",

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