Flip-chip integration of selectively oxidized 850 nm VCSEL arrays

K. M. Geib, Kent D Choquette, A. A. Allerman, J. J. Hindi

Research output: Contribution to journalArticlepeer-review


Combinations of dense numbers of high performance photonic and microelectronic devices originating from disparate technologies are needed to achieve the next generation of information process, interconnect, and intelligent sensing microsystems. This article introduces the fabrication techniques for flip-chip integration of selectively oxidized 850 nm 8×8 individual addressable VCSEL arrays.

Original languageEnglish (US)
Pages (from-to)850-851
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
StatePublished - 2000
Externally publishedYes

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering


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