Abstract
Combinations of dense numbers of high performance photonic and microelectronic devices originating from disparate technologies are needed to achieve the next generation of information process, interconnect, and intelligent sensing microsystems. This article introduces the fabrication techniques for flip-chip integration of selectively oxidized 850 nm 8×8 individual addressable VCSEL arrays.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 850-851 |
| Number of pages | 2 |
| Journal | Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS |
| Volume | 2 |
| State | Published - 2000 |
| Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering