Flip-Chip Bonding Product Development

Duane Louderback, Jongwoo Kim, Richard Stone, Peter Guilfoyle, Kent Choquette, Fouad Kiamilev

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Flip-chip bonding is an important process for OptiComp Corporation's future product line. We present various components for flip-chip bonding, including VCSELs, photodetectors, and CMOS, as well as discuss our ongoing flip-chip bonding development effort.

Original languageEnglish (US)
Title of host publicationOptics in Computing, OC 2001
PublisherOptica Publishing Group (formerly OSA)
Pages125-127
Number of pages3
ISBN (Electronic)1557526575
StatePublished - 2001
EventOptics in Computing, OC 2001 - Lake Tahoe, United States
Duration: Jan 9 2001 → …

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Conference

ConferenceOptics in Computing, OC 2001
Country/TerritoryUnited States
CityLake Tahoe
Period1/9/01 → …

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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