TY - GEN
T1 - FlexiCores
T2 - 49th IEEE/ACM International Symposium on Computer Architecture, ISCA 2022
AU - Bleier, Nathaniel
AU - Lee, Calvin
AU - Rodriguez, Francisco
AU - Sou, Antony
AU - White, Scott
AU - Kumar, Rakesh
N1 - Publisher Copyright:
© 2022 Institute of Electrical and Electronics Engineers Inc.. All rights reserved.
PY - 2022/6/18
Y1 - 2022/6/18
N2 - Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requirements. A microprocessor is a critical component for many such applications; however, it is unclear whether it is feasible to build flexible processors at scale (i.e., at high yield), since very few flexible microprocessors have been reported and no yield data or data from multiple chips has been reported. Also, prior manufactured flexible systems were not feld-reprogrammable and were evaluated either on a simple set of test vectors or a single program. A working flexible microprocessor chip supporting complex or multiple applications has not been demonstrated. Finally, no prior work performs a design space of flexible microprocessors to optimize area, code size, and energy of such microprocessors. In this work, we fabricate and test hundreds of FlexiCores-flexible 0.8 µ m IGZO TFT-based feld-reprogrammable 4 and 8-bit microprocessor chips optimized for low footprint and yield. We show that these gate count-optimized processors can have high yield (4-bit FlexiCores have 81% yield-sufcient to enable subcent cost if produced at volume). We evaluate these chips over a suite of representative kernels-the kernels take 4.28 ms to 12.9 ms and 21.0 µ J to 61.4 µ J for execution (at 360 nJ per instruction). We also present the frst characterization of process variation for a flexible processor-we observe signifcant process variation (relative standard deviation of 15.3% and 21.5% in terms of current draw of 4-bit and 8-bit FlexiCore chips respectively). Finally, we perform a design space exploration and identify design points much better than FlexiCores-the new cores consume only 45-56% the energy of the base design, and have code size less than 30% of the base design, with an area overhead of 9-37%.
AB - Flexible electronics is a promising approach to target applications whose computational needs are not met by traditional silicon-based electronics due to their conformality, thinness, or cost requirements. A microprocessor is a critical component for many such applications; however, it is unclear whether it is feasible to build flexible processors at scale (i.e., at high yield), since very few flexible microprocessors have been reported and no yield data or data from multiple chips has been reported. Also, prior manufactured flexible systems were not feld-reprogrammable and were evaluated either on a simple set of test vectors or a single program. A working flexible microprocessor chip supporting complex or multiple applications has not been demonstrated. Finally, no prior work performs a design space of flexible microprocessors to optimize area, code size, and energy of such microprocessors. In this work, we fabricate and test hundreds of FlexiCores-flexible 0.8 µ m IGZO TFT-based feld-reprogrammable 4 and 8-bit microprocessor chips optimized for low footprint and yield. We show that these gate count-optimized processors can have high yield (4-bit FlexiCores have 81% yield-sufcient to enable subcent cost if produced at volume). We evaluate these chips over a suite of representative kernels-the kernels take 4.28 ms to 12.9 ms and 21.0 µ J to 61.4 µ J for execution (at 360 nJ per instruction). We also present the frst characterization of process variation for a flexible processor-we observe signifcant process variation (relative standard deviation of 15.3% and 21.5% in terms of current draw of 4-bit and 8-bit FlexiCore chips respectively). Finally, we perform a design space exploration and identify design points much better than FlexiCores-the new cores consume only 45-56% the energy of the base design, and have code size less than 30% of the base design, with an area overhead of 9-37%.
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U2 - 10.1145/3470496.3527410
DO - 10.1145/3470496.3527410
M3 - Conference contribution
AN - SCOPUS:85132833300
T3 - Proceedings - International Symposium on Computer Architecture
SP - 831
EP - 846
BT - ISCA 2022 - Proceedings of the 49th Annual International Symposium on Computer Architecture
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 18 June 2022 through 22 June 2022
ER -